Supercooled Solder Paste
Encapsulated particles of liquid solder alloys that flow and solidify when activated at low temperature lower than the alloy’s melting point.
At scale, millions of the encapsulated particles are suspended in a flux to make a stencil printable and heat activated supercooled solder paste.
Oxide shell applied to molten alloy prevents solidification and allows the metal particles to remain liquid at temperatures significantly below the freezing point.
Encapsulated supercooled liquid metal particles applied to substrates as delicate as a rose petal