The electronics manufacturing world has long desired a low heat processing solution. Advanced electronics designs with lightweight flexible substrates and sensitive miniaturized components require a dramatic reduction in processing heat while still maintaining high operating temperature requirements and reliability. SAFI-Tech’s patented platform allows SAC305, the industry standard high temperature alloy and other alloys, to be processed at dramatically lower temperatures opening the door to the future of electronics.
Revolutionizing Design
Thinner - Lighter - Flexible
Removing heat from electronics manufacturing redefines design capabilities by enhancing miniaturization, enabling the use of desirable substrates, and achieving the highest resolution prints.
Eliminating Cost
Energy - Environment
Reducing the temperature and time required in reflow ovens delivers significant energy savings while also reducing carbon emissions.
Throughput - Footprint
Reducing time required in reflow ovens increases volume throughput and reduces required size of reflow oven
Materials - Yields
Reducing exposure to high temperatures allows for less temperature-created defects such as head-in-pillow and thermal degradation